The CTP system for thermal offset plates
The XPose! Thermal was developed for use in job and packaging printing. It is also optimally suited for service providers and is available for all plate formats.
The imaging device offers a quick return on investment and is commercially viable at plate quantities above 5,000 m2/year.
The following sizes of CTP system are available:
• XPose! 230 Thermal
• XPose! 260 Thermal
• XPose! 260-L Thermal
• XPose! 260-XXL Thermal
• XPose! 290 Thermal (on request)
The number of lasers can be varied from 32 to 64. For plates with high energy requirements, HiPower lasers can be chosen in order to enable high imaging speeds. With resolutions up to 10,000 dpi, XPose! Thermal can handle all customer-specific demands on an individual basis.
830 nm Thermal laser diodes
The XPose! Thermal is built on proven technology which uses thermal laser diodes for the imaging of traditional thermal offset plates. The laser diodes are characterised by their long performance life and by the fact that they do not require water cooling. We have been working successfully with thermal technology for 15 years.
Thermal offset plates
Thermal offset plates satisfy the highest quality requirements and are used in security and bank note printing. In Europe, thermal offset plates are the most frequently used plate type. You will also benefit from a large choice of plates from various manufacturers.
Thermal plates can be processed in daylight. Even without baking, the plate offers high print runs. Plates are also available for UV colours. Through baking of the plate, the print run can be dramatically increased.