The new CL light Converting Machine from Mühlbauer covers a high range of possibilities - dry inlay, wet inlay, Smart Labels and tickets, from reel to single or from reel to reel - all in one modular system. This Converting Machine includes all processes in one platform: reel-to-reel antenna web handling, label/ticket lamination, die cutting as well as output testing - of course, with leading edge performance, high quality and the best cost/performance ratio available on the converting market. The friendly user interface, the intuitive handling of this converting machine and above all the low initial investment makes the CL light a perfect converting machine for start ups. With a throughput of up to 30 m/min. and an optimized change-over time between different products, this converting machine is perfectly suited for a flexible production with changing applications.
Get ready to enter the growing RFID label market and contact us today for more information!
With the new Personalization Lines, Mühlbauer follows the increasing demand for RFID and NFC products that include special printed features, serialization printing and unique encoding. The PL light RFID Personalization System is designed for low to medium volumes with a throughput of up to 18,000 units per hour. The process includes UHF chip encoding as well as printing variable data for graphical personalization. Both, Reel to Reel as well as Ticket to Ticket usage is possible. A maximum web width of 110 mm can be processed. With its modular design other processes can be integrated on request.
With the small footprint, a print resolution of 600 dpi and the TIJ (Thermal Inkjet) printer, the PL light is the ideal solution for your service bureau.
Incoming chip modules are tested for electrical functionality and mechanical dimensions. Customized electrical tests can be performed according to different test patterns for contact and contactless chips. Identified reject modules are marked by reject punching, enabling the pre-personalization of a determined quantity of IC Modules.
During this process step cavities for IC Modules are milled into the card bodies. The cavities are dimensioned according to the size of the module to be implanted. To free the antenna inside the card body, the antenna touch system which detects any kind of antenna stops on the antenna surface with highest accuracy.
At the encapsulation process of IC Module Production, the resin is dispensed to protect chip and wires against mechanical and environmental stress. Typically, the black thermal curing material or the transparent UV curing material are used for the encapsulation. Due to the high accuracy of this method, no additional surface treatment like milling is necessary. For the dispensing process itself, two different methodes can be used: Dam&Fill or Glob Top. In the Dam&Fill mode, the first dispensing head places a dam bar to limit the glob top area. Then, a second dispensing head fills the area inside the dam. In the Glob Top mode, both dispensing heads completely fill the whole module.
The Mühlbauer Group is the only one-stop-shop technology partner for the card, Smart Card, passport/ePassport and RFID industry. With around 3,000 employees, technology centers in Germany, China, Malaysia, Slovakia, the U.S. and Serbia as well as a global sales and service network, the Mühlbauer Group is the worlds market leader in innovative systems and software solutions for the production and personalization of cards, passports and RFID applications. Additionally, Mühlbauer supports its customers in project planning, technology transfer including system integration and production support.